Capabilities
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Items
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Specification
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Maximum Layer Count
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24 Layers
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Finished Board Thickness
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16mil ~ 128mil (0.4mm ~3.2mm)
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Maximum Dimension
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20" x 24" (508mm x 610mm)
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Minimum Line Width / Spacing
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4mil / 4mil (0.1mm / 0.1mm)
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Minimum Mechanical Hole Diameter
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10mil (0.25mm)
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| Minimum Laser Hole Diameter |
4mil (0.1mm)
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Minimum Solder PAD Diameter
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10mil (0.25mm)
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Hole Position Presision
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2mil (0.05mm)
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Minimum Hole to Hole Spacing
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12mil (0.3mm)
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Minimum Hole to Edge Spacing
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8mil (0.2mm)
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Surface Treatment
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HAL, Lead Free HAL, Flash Gold, ENIG, OSP, Imm. Siliver, Imm. Tin
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Minimum Hole Wall Thickness
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>18um
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Maximum Aspect Ratio
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8.0 : 1
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Minimum Annular Ring
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4.5mil (0.115mm)
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Maximum Thickness of Wiring
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Inner Layer: 3oz, Outer Layer:4oz
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Minimum Height of Characters
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32mil (0.8mm)
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Minimum Size of Punched Hole
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0.1" (2.5mm)
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Controlled Impedance
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+/- 10%
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Outline Precision (CNC)
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4mil (0.1mm)
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Outline Precision (Punch)
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2mil (0.05mm)
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HDI Construction
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BVH/ Build up/ 1+N+1/ 2+N+2
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