Binding flexible and rigid boards structure together in same units as one part so called rigid-flex boards.
Features :
- Better reliability, signal integrity, noise reduction, and impedance control.
- Reduces mechanical space and device weight.
- Improves design freedom HDI microvia.
- Cost-saving alternative to multi-layer FPC.
- Full range of products: Single-Sided, Double-Sided & Multi-Layer board
Material
|
Supply Name
|
Polyester
|
Polyimide
|
Layer
|
Single, Double, Multi Layer, Flex-Rigid
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Base Material Thickness (um)
|
12.5/25/50/75/100
|
12.5/25/35/50
|
Copper conductor thickness (um)
|
18, 35, 50, 70, 105
|
Min Conductor Space and Width (mm)
|
0.075 +/- 0.02
|
Min Hole Dia (mm)
|
Dia. 0.2 +/- 0.03
|
Max Panel Size (mm)
|
1800 x 400
|
Flexibility
|
R=7, 120 Times/min, Movement distance 20mm Bending 1 x 10' times, no fracture
|
Peel Strength (N/mm)
|
1.0
|
Solderability
|
160 °C/ 5Sec
|
300 °C / 10Sec
|
Insulation Resistance
|
> 500M Ω
|
Withstand Voltage
|
> 1000V/mm
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