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Maximum Layer Count
24 Layers
Finished Board Thickness
16mil ~ 128mil (0.4mm ~3.2mm)
Maximum Dimension
20" x 24" (508mm x 610mm)
Minimum Line Width / Spacing
4mil / 4mil (0.1mm / 0.1mm)
Minimum Mechanical Hole Diameter
10mil (0.25mm)
Minimum Laser Hole Diameter
4mil (0.1mm)
Minimum Solder PAD Diameter
10mil (0.25mm)
Hole Position Presision
2mil (0.05mm)
Minimum Hole to Hole Spacing
12mil (0.3mm)
Minimum Hole to Edge Spacing
8mil (0.2mm)
Surface Treatment
HAL, Lead Free HAL, Flash Gold, ENIG, OSP, Imm. Siliver, Imm. Tin
Minimum Hole Wall Thickness
Maximum Aspect Ratio
8.0 : 1
Minimum Annular Ring
4.5mil (0.115mm)
Maximum Thickness of Wiring
Inner Layer: 3oz, Outer Layer:4oz
Minimum Height of Characters
32mil (0.8mm)
Minimum Size of Punched Hole
0.1" (2.5mm)
Controlled Impedance
+/- 10%
Outline Precision (CNC)
4mil (0.1mm)
Outline Precision (Punch)
2mil (0.05mm)
HDI Construction
BVH/ Build up/ 1+N+1/ 2+N+2